China Embedded SW Engineer
宽腾达通讯（无锡）有限公司
- 公司规模：150-500人
- 公司性质：外资(欧美)
- 公司行业：通信/电信/网络设备 电子技术/半导体/集成电路
职位信息
- 发布日期：2014-08-18
- 工作地点：无锡
- 招聘人数：若干
- 工作经验：三年以上
- 学历要求：本科
- 语言要求：英语良好
- 职位类别：嵌入式软件开发(Linux/单片机/DLC/DSP…)
职位描述
KEY RESPONSIBILITIES:
1. Responsible for development of software and firmware of high-performance Wi-Fi chipsets, including design, coding, bug fixing, unit and integration tests
2. Responsible for design of new software features and the research of new technologies
3. Work closely with the U.S. and Australia software and QA teams on integration tests and field trials
4. Support for produce verification, validation and release activities
5. Support customer requirements in Asian region, especially with ODM’s and OEM’s in China
QUALIFICATIONS:
1. Bachelor or Master in EE, CS, CE, or related disciplines with 4+ years experience in embedded software/firmware development on Linux platform
2. Proficiency of C programming skills, assembly language is a plus
3. Experience of wireless drivers and/or other networking drivers, especially in Wi-Fi area, is preferred
4. Experience of development for Linux kernel and driver is preferred
5. Quick learner, eager to grow with new technologies. Self-motivated and strive for high performance.
6. Team player with ability to cooperate with people from diverse cultures to achieve targets
7. Good written and oral communication skills in English, CET-6 is preferred.
8. Good communication and problem solving skills and ability to work under high pressure
PLUSES:
1. In depth of experience with 802.11 protocol suite and WLAN technology is a big plus
2. Experience of IP networking with good knowledge of TCP/IP and/or network security is preferred
3. Knowledge of CPU architecture, DMA, Cache, DSP and PCI/PCI-E is an asset
4. Knowledge of RF, Regulatory, OFDM, and MIMO is an asset
5. Experience in Bootloader, OS layer, driver layer or middleware development is an asset
6. Experience in release processes, build and packaging as well as life cycle and delivery mechanisms is an asset
7. Prior work experience in the U.S. or U.S. based multi-national firms is an asset
Contact：hr_wuxi@quantenna.com
1. Responsible for development of software and firmware of high-performance Wi-Fi chipsets, including design, coding, bug fixing, unit and integration tests
2. Responsible for design of new software features and the research of new technologies
3. Work closely with the U.S. and Australia software and QA teams on integration tests and field trials
4. Support for produce verification, validation and release activities
5. Support customer requirements in Asian region, especially with ODM’s and OEM’s in China
QUALIFICATIONS:
1. Bachelor or Master in EE, CS, CE, or related disciplines with 4+ years experience in embedded software/firmware development on Linux platform
2. Proficiency of C programming skills, assembly language is a plus
3. Experience of wireless drivers and/or other networking drivers, especially in Wi-Fi area, is preferred
4. Experience of development for Linux kernel and driver is preferred
5. Quick learner, eager to grow with new technologies. Self-motivated and strive for high performance.
6. Team player with ability to cooperate with people from diverse cultures to achieve targets
7. Good written and oral communication skills in English, CET-6 is preferred.
8. Good communication and problem solving skills and ability to work under high pressure
PLUSES:
1. In depth of experience with 802.11 protocol suite and WLAN technology is a big plus
2. Experience of IP networking with good knowledge of TCP/IP and/or network security is preferred
3. Knowledge of CPU architecture, DMA, Cache, DSP and PCI/PCI-E is an asset
4. Knowledge of RF, Regulatory, OFDM, and MIMO is an asset
5. Experience in Bootloader, OS layer, driver layer or middleware development is an asset
6. Experience in release processes, build and packaging as well as life cycle and delivery mechanisms is an asset
7. Prior work experience in the U.S. or U.S. based multi-national firms is an asset
Contact：hr_wuxi@quantenna.com
公司介绍
宽腾达通讯（无锡）有限公司成立于2011年3月18日，总投资200万美元，是一家由美国硅谷顶尖的风险基金投资的无晶园芯片开发公司，致力于开发802. 11n MIMO无线局域网芯片组。宽腾达公司成立于2006年，总部位于美国加州Fremont，并在澳洲悉尼和中国大陆无锡开设有研发分部。作为业界第一家商用化4*4MINO方案提供商，这些芯片组为无线网络和设备提供高的性能、速度和可靠性。宽腾达公司目前产品已经商用，客户包括摩托罗拉NETGEAR等著名的设备生产商，和瑞士电信等一流电信运营商。
联系方式
- Email：wuxi@quantenna.com