process engineer
欧司朗光电半导体（中国）有限公司
- 公司规模：1000-5000人
- 公司性质：外资(欧美)
- 公司行业：电子技术/半导体/集成电路
职位信息
- 发布日期：2013-06-16
- 工作地点：昆山
- 招聘人数：若干
- 语言要求：英语
- 职位类别：半导体技术
职位描述
Job Responsibilities:
Improvement, stabilize key processes like Wire bonding, molding, trim & form in a systematic way (i.e. DoE and SPC)
Able to apply DOE and drive Process Improvement Program.
Review and improve process monitoring and control (effecitve use of SPC) to achive sustainable process stability
Support in yield improvement activities (systematic and sustainable yield improvement methodology - data gathering, analysis, hypothesis, validation, corrective action)
Initiate and support cost down activities
Coaching of a systematic problem solving procedure
Support QA in customer complaints
Manage PPCM (Product Process Change Management).
Periodic meeting to review effectiveness of result.
Interface to OS process engineers
Identify root cause, initiate & involve with line quality improvement.
Job Requirements:
Degree in Mechanical/Microsystem Engineering or equivalent.
At least with 5 years of related work experience.
Requires 8D, SPC, DoE, computer skills,
Requires experiences min 2 of the following fields: die bonding, wire bonding, molding, casting, trim & form
Able to work under minimum supervision.
Requires computer skills with common Microsoft knowledge.
Initiative & enthusiastic, good knowledge in problem solving, sense of responsibility, high adaptability, good leadership.
Good interpersonal and communication skill, work independently, resourceful.
Must be able to read, write & communicate in English & Chinese.
Requires assertiveness
Improvement, stabilize key processes like Wire bonding, molding, trim & form in a systematic way (i.e. DoE and SPC)
Able to apply DOE and drive Process Improvement Program.
Review and improve process monitoring and control (effecitve use of SPC) to achive sustainable process stability
Support in yield improvement activities (systematic and sustainable yield improvement methodology - data gathering, analysis, hypothesis, validation, corrective action)
Initiate and support cost down activities
Coaching of a systematic problem solving procedure
Support QA in customer complaints
Manage PPCM (Product Process Change Management).
Periodic meeting to review effectiveness of result.
Interface to OS process engineers
Identify root cause, initiate & involve with line quality improvement.
Job Requirements:
Degree in Mechanical/Microsystem Engineering or equivalent.
At least with 5 years of related work experience.
Requires 8D, SPC, DoE, computer skills,
Requires experiences min 2 of the following fields: die bonding, wire bonding, molding, casting, trim & form
Able to work under minimum supervision.
Requires computer skills with common Microsoft knowledge.
Initiative & enthusiastic, good knowledge in problem solving, sense of responsibility, high adaptability, good leadership.
Good interpersonal and communication skill, work independently, resourceful.
Must be able to read, write & communicate in English & Chinese.
Requires assertiveness
公司介绍
欧司朗 OSRAM AG 总部设于德国的慕尼黑，是西门子 Siemens AG 全资拥有的子公司，也是世界两大照明制造商。截止到 2011 年 9 月 30 日，欧司朗财政年度销售总额高达 50 亿欧元。欧司朗是照明领域的高科技公司，其销售收入的 70% 以上来自节能产品。欧司朗放眼全球，截止到 2011 年 9 月 30 日，其在 16 个国家和地区设有 44 个生产基地，全球雇员超过 41,000 名，客户遍及 150 个国家和地区。
欧司朗光电半导体是世界两大领先光电制造商之一，供应照明、可视化和传感领域，总部位于德国雷根斯堡（约 1800 名员工），现有生产基地设在德国的雷根斯堡和马来西亚的槟城（约 4000 名员工)，目前在江苏省无锡新区新建第三个生产基地，预计于2013年年底前完工并投产，占地面积约十万平方米。
欧司朗光电半导体是世界两大领先光电制造商之一，供应照明、可视化和传感领域，总部位于德国雷根斯堡（约 1800 名员工），现有生产基地设在德国的雷根斯堡和马来西亚的槟城（约 4000 名员工)，目前在江苏省无锡新区新建第三个生产基地，预计于2013年年底前完工并投产，占地面积约十万平方米。