天津招聘

职责:
1. DFM结果分析与实际验证.
2. 新产品试产与实施,并支持量产新产品的流程优化.
3. 生产工艺流程的优化(PCB拼板设计, 各类夹具设计, 各类焊接温度的定义与优化,底部充胶工艺, 产量提升, 文件编写,etc)
4. 各类焊接缺陷分析.
5. 执行各类焊接缺陷分析方法的实施 (X-section, Red-dye, EDX, C-SAM, etc.)
6. 各类锡膏印刷缺陷分析(漏印, 多锡, 少锡, 短路, 偏位, 拉尖 等等)
7. 新技术的评估. (如POP)
8. 新化学材料的使用 (Under-fill, Solder paste, Flux, Solvent)
9. 应用6-SIGMA工具评估新设备 (CPK, GR&R, etc)
10. 应用6-SIGMA工具对工艺流程进行优化. (DOE, SPC, Hypothesis testing)
11. 各类生产夹具的设计与验证, 如丝网印刷夹具, 网板的开孔定义与优化, 回流焊接夹具, 分板夹具, 点胶夹具, 波峰焊接夹具,
12. 各类反修夹具, Hot-bar和ACF焊接夹具.
职位要求：
1. 大专以上
2. 主修电子焊接或相关工程
3. 英语书写通畅口语沟通流利 (对工艺流程问题需英语与外国客户进行面对面的沟通和辩论)
4. 熟悉6-SIGMA工具的使用, 如DOE, GRR, SPC, CPK, Hypothesis 等等.
5. 熟悉各类办公软件和PCB 文件查看软件 (最好能熟悉CAD或Pro-E软件)
6. 心境开阔, 性格成熟稳重
7. 善于沟通并有领导能力和团队精神
8. 5年以上的SMT回流焊接经验并熟悉DFM的要求.
9. 2年以上的波峰焊接缺陷实际处理经验.
10. 动手能力强, 能制做标准的炉温测试板并测试温度, 能熟练的使用烙铁.
11. 能吃苦耐劳, 可承受工作压力.
Responsibility:
1. Design for manufacturing analysis.
2. Proto-build process management with carry out, and support on each mass production as necessary.
3. Process development (PCB panel design, Fixture design, Profile Optimization, Under-fill, Documentation, UPH improvement etc)
4. Failure analysis with various soldering defects.
5. Failure analysis with various experiment methods (X-section, Red-dye, EDX, C-SAM, etc.)
6. Failure analysis on solder paste printing with various defects. (Missing paste, Excessive and Insufficient paste, Short Bridge,
7. Misalignment, Solder tip, etc)
8. New Technologies assessment. (POP)
9. New chemical material use method (Under-fill, Solder paste, Flux, Solvent)
10. New equipment assessment (CPK, GR&R, etc)
11. Continuous process improvement. (DOE, SPC, Hypothesis testing)
12. Fixture design for solder paste printing (Support block and Stencil), Reflow carrier, PCB De-panel, PCBA Under-fill,
13. Wave soldering fixture, Rework fixture, Hot-bar or ACF bonding fixture
Position Requirement
1. College degree or above
2. Major in Soldering engineering and related engineering
3. Fluent in oral English (Need communicate with Foreigner from customer to solve sophisticated process issue)
4. Familiar with SPC and 6-sigma methodologies which special on DOE, GRR, SPC, CPK Hypothesis (Minitab)
5. With good operations on office software and various PCB Gerber review software and CAD or Pro-E
6. Common sense, social confidence and maturity
7. Strong leadership and ability to lead by example
8. Good Teamwork player.
9. At least 5 years experience in SMT process or DFM
10. With SMT and wave soldering experience is perfect.
11. Skillful in manual work on profile board fabrication and measurement, also including fixture buyoff and manual rework with solder iron.
12. Able to work under conditions of great pressure and resource constraint

伟创力简介

伟创力国际有限公司是全球领先的从概念成型到规模量产(sketch- to-scale) 解决方案供应商，为互联世界设计和制造智能产品。公司在 30 多个国家有近 200,000 万专业人士并且助力全世界开创智慧生活 (Live smarter)，并向不同行业和终端市场中各种规模的公司提供创新设计、工程、制造、供应链实时管控和物流服务。

在中国，伟创力占有1250万平方英尺生产面积，其中包括15个生产基地、研发中心、销售办公室以及1个区域支持中心。伟创力的10万员工提供包括但不限于制造设计、核心新品引进、印刷电路板组装、分部装配、总装、测试、外壳及物流的服务。

如欲了解更多伟创力的招聘信息，请访问*****************************************/en-US/Careers

Flex Overview
Flex is a leading sketch-to-scale solutions company that designs and builds intelligent products for a connected world. With approximately 200,000 professionals across 30 countries and a promise to help the world Live smarter, the company provides innovative design, engineering, manufacturing, real-time supply chain insight and logistics services to companies of all sizes in various industries and end-markets.

In China, Flex has amassed 12.5M manufacturing sq.ft. comprising 15 manufacturing sites, R&D & Tech Centres, Sales Office and a Regional Support Centre. Staffed by 100,000 employees, we provide services that include, but are not limited to design, new product introduction (NPI), printed circuit board assembly (PCBA), sub-assembly and full-assembly, test, enclosures, and logistics.

For more information about Flex vacancies, pls access *****************************************/en-US/Careers