深圳招聘

Wire bond technology development.

Wire bonding process recipe development for new product.

Wire bonding process control to reach better yield and reliability.

Wire bonding process yield improvement.

New product design risk assessment. And suggest for design optimize.

Co-work with material team with new package related material evaluation.

8D/RCA/DMAIC to solve WB issue.

Innovation to improve WB process Yield/UPH. Or to support new product success.

WB process coacher for new employee and for the engineers from cross training program.

Requirement:

Bachelor Degree in Semiconductor, Material, engineering, Mechanics.

Have basic knowledge of Material science and its mechanical and thermal characteration.

Capable of Experiment Design and Statistical Analysis.

Good communication/team work/planning skills.

Good Computer & Microsoft Office skills are required.

Be capable of occasionally over-time and shift work.

Good English communication and interpersonal skills.