苏州 [切换城市] 苏州招聘苏州电子/电器/半导体/仪器仪表招聘苏州集成电路IC设计/应用工程师招聘

高级应用工程师Senior Applications Engr

芯禾科技

  • 公司规模:50-150人
  • 公司性质:合资(欧美)
  • 公司行业:电子技术/半导体/集成电路

职位信息

  • 发布日期:2014-05-29
  • 工作地点:苏州
  • 招聘人数:若干
  • 职位类别:FAE 现场应用工程师  集成电路IC设计/应用工程师

职位描述

Position Description

1. Provide technical support for Xpeedic's RF IC design product, mainly focusing on analog/RF/mixed-signal circuit simulation products.

2. Has thorough understanding of RFIC marketplace and objectives, including key players, products and trends.

3. Support sale to address customers' technical demand to propose and deliver value position for maximizing business opportunities.

4. Conduct products demonstration, presentation, workshop and benchmark to address the customer's technical concerns.

5. Provide post-sales support such as products training, software environment maintain, products usage guide to assure customer satisfaction and nurture future sales potentials.

6. Ability to openly exchange and communicate technical information with peers, group management, and customers.


Position Requirements:

1. Bachelor's degree majoring in electronic engineering, with 2+ years experience in Analog and RF IC design. Master's degree or up is preferred.

2. Experience with Cadence Virtuoso platform and Agilent ADS is required.

3. Strong verbal and written skills in English are required.

4. Have good communication skill and teamwork spirit.

公司介绍

芯禾科技(xpeedic technology, inc.)创立2010年,致力于成为国内最好的面向世界的高性能电子设计自动化软件和设计服务的供应商。芯禾科技的创业团队包括电子设计自动化和光电设计业界有着丰富创业经验的***专家,他们已经在高速电路、无线射频、 数模混合电路、集成电路、封装设计等领域提供高质量的软件产品和设计服务。芯禾科技目前有风险投资公司的资金支持。

xpeedic technology, inc. was founded in 2010 by a team of industry experts to provide high performance eda software and differentiating electronic design engineering services. xpeedic is helping customers in the area of high speed digital designs, ic package designs, and rf analog mixed-signal designs. our engineering team has extensive experience in developing industry-leading eda software and has a proven track record for successfully delivering engineering service projects.
the company is backed by venture capital funding.

联系方式

  • 公司地址:上班地址:台北、新竹