上海招聘

Product Engineer Job Description

Job Function

Candidate will be responsible for driving yield and performance improvements of advanced mix-signal products with wafer foundry partners during all phase of product life cycle including process development, production ramp, and high-volume manufacturing. Also will be responsible for new tape out by collaborating closely with internal design team and interface with foundry customer service team.

Responsibilities

1. Fully take charge of new tape out.

2. Analyze yield, process, diagnostic, design, and semiconductor test data to ramp new process nodes, drive baseline yield improvement, and isolate root causes of yield loss and product performance degradation.

3. Forecast future product yields using yield modeling and analysis for new products on future nodes and existing nodes.

4. Collaborate with wafer foundries, and Credo test and design teams to isolate root causes of yield loss and drive improvements.

5. Develop advanced data mining, heuristics, and yield analysis capabilities and tools required for yield debugging.

6. Drive standardization and adoption of new improvements with operation team member.

7. Interface with management and business teams to provide yield outlook for product planning and cost analysis.

8. Lead task forces to address and drive resolution of wafer yield excursions.

Basic Qualifications

Minimum 3 years experience in process integration, device engineering, and/or process development. Hands-on work experience as a process, integration, yield, or technology development engineer in wafer fab is a must. Knowledge of device physics, reliability failure mechanisms, and chemistry/physics of wafer fabrication processes are also required. Knowledge and practical use of statistical methods including SPC, DOE, and RSM, and statistical or yield analysis software such as JMP, DataPOWER, or Minitab is a plus.

Education Requirements

Bachelor or above in Electrical Engineering, Physics, Materials Science, or related discipline required.

JLSemi景略半导体（金阵微电子）是一家推动网络通信技术发展的芯片设计公司，专注于为汽车、工业和网通等市场提供高速、高性能和低功耗的网络通信芯片和解决方案；公司成立于2009年，拥有20多项自主创新的技术专利，是国家高新技术企业和RISC-V产业联盟理事单位。

“自主创芯，用芯连接”，基于高性能的数模混合芯片技术和创新的芯片架构技术 – EtherNext高速以太网物理层接口PHY技术和BlueWhale L2/L2+交换机Switch技术-JLSemi的以太网PHY和Switch芯片在性能、可靠性和功耗等方面具有行业优势；2019年成功流片车载千兆以太网PHY芯片，成为中国独此一家具备单对线千兆和标准万兆高带宽传输技术的公司；2020年起，陆续推出Cheetah系列车载以太网PHY芯片，Antelope系列工业以太网PHY芯片和SailFish系列SOHO/SMB网通芯片进入多个细分行业市场，获得客户的高度认可。

JLSemi核心团队来自硅谷一线半导体公司，包括Marvell、ADI、Cadence、Cisco等国际大厂，在模拟、数字、DSP和混合信号设计等领域都颇有造诣，积累了丰富的芯片设计、生产和运维经验，主导开发的通信芯片累计出货量达十亿颗以上；公司研发实力雄厚，团队成员既有来自国际知名半导体公司经验丰富的工程师，也有毕业自国内一流院校充满激情和天赋的年轻人，构成一支以中青年为骨干，技术全面的芯片研发梯队。

JLSemi于2019年进行战略重组，成立南京金阵微电子技术有限公司作为运营主体，在上海、南京、深圳、杭州、Hongkong和Singapore等地设有研发、测试和运维中心，聚焦数百亿美元规模的网通芯片市场，已经成为这一赛道的龙头企业，欢迎精英人才的加入，共同高速成长，共创美好未来！