上海招聘

Job Responsibilities:
1.Develop or integrate the process flow for new technology or devices, which meet product's requirements;
2.Work with Unit Process Module group to develop new process recipes and insure new recipes are manufacturable;
3.Design the testkeys/monitor structures for new technology and new devices development, characterization and qualification;
4.Perform failure analysis, line issues cleanup and yield enhancement;
5.Monitor process trend on inline/WAT SPC and product yield;
6.Process benchmark with other fab;
7.Determine and maintain the topological and electrical design rules;
8.Measure electrical characteristics of the devices such as MOS, BJT, Capacitor, Resistor, Diode etc.
9.Work with Design Service engineer to create CAD environment, for example DRC, LVS, Spice Models, PDK;
10.Obtain competitive advantages and exclusive rights by writing papers and patents;
11.Be responsible to interact with internal & external customers and respond to customers’ technical queries.
12.Transfer new technology to manufacture;
13.Provide mentorship to fresh (device/integration) engineers/AEs;
14.Other works involved activities covering the entire process development spectrum.

Experience Requirements:
1.At least 3 years of TD integration experience in semiconductor industry;
2.Familiar with semiconductor manufacture and CMOS process integration;
3.Experience working with design and application teams, knowledge on design rules ( physical and electrical );
4.Familiar with semiconductor test methods;
5.Understand reliability mechanism;
6.Strong capabilities of problem analysis and diagnosis techniques;
7.Understand statistics and DOE

    代工事业群（Foundry Business Group，简称FBG）是华润微电子旗下全面负责晶圆代工与掩模制造的业务单元。
晶圆代工服务基于8英寸与6英寸的生产线提供1.0-0.11μm的工艺制程，为客户提供广泛的晶圆制造技术，包括BCD、Mixed-Signal、HV CMOS、RFCMOS、e-NVM、BiCMOS、Logic、MOSFET、IGBT、SOI、MEMS、Bipolar等一系列特色工艺平台，同时也提供客制化工艺平台开发和设计服务。相关工艺主要针对国家新兴产业与市场需求进行重点布局，在电源管理、智慧照明、射频应用、汽车电子、智能消费电子、物联网、智能电网等领域为客户提供多样化的工艺平台解决方案。
    掩模业务拥有业界领先的激光和电子束等制版设备，可为客户提供Frame、IP Merge、OPC等专项服务，能提供普通掩模（Binary）、移相掩模（PSM）、灰阶掩模（Gray Mask）等先进的掩模产品，广泛用于IC、分立器件、MEMS、LED、Bumping等领域。
    代工事业群将秉承独立的代工模式，依托华润微电子开放式制造平台，研发新的工艺加工技术，增强产品制造与技术服务核心能力，打造高品质模拟功率半导体和智能传感器制造平台，帮助客户实现价值的***化。

公司联系人及地址：
无锡：唐***，电话：0510-88115339，邮箱：tangm@csmc.crmicro.com，地址：无锡市新洲路8号
无锡：杨***，电话：0510-81805760，邮箱：ymhr@ym.crmicro.com，地址：无锡市梁溪路14号