上海 [切换城市] 上海招聘上海电子/电器/半导体/仪器仪表招聘上海集成电路IC设计/应用工程师招聘

Junior Software Applications Engineer (BLE)

戴泺格半导体(深圳)有限公司

  • 公司规模:1000-5000人
  • 公司性质:外资(欧美)
  • 公司行业:电子技术/半导体/集成电路

职位信息

  • 发布日期:2021-01-12
  • 工作地点:上海-徐汇区
  • 招聘人数:1人
  • 工作经验:无需经验
  • 学历要求:本科
  • 职位月薪:1-1.5万/月
  • 职位类别:集成电路IC设计/应用工程师

职位描述

The Role

Working as a Junior Software Applications Engineer based in Shanghai, you will:

·         Support customers on their application software / profile implementation on Smartbond (and roadmap products). Ability to provide deep level hands-on customer support in elements such as debugging, code porting, code optimisation, peripheral utilization, clocking, memory configuration customers own profile development, tool optimization and general software/hardware support of MCU, testing and optimizing for manufacture.

·         Customising reference designs from the Business unit to local customer needs.

·         Creating proof of concepts and demo’s (including developing software)

·         Support where necessary customers modifying/developing custom profiles

·         Providing feedback to the product line on suggestions to improve deliverables: tools / device / architecture / reference designs

·         Supporting Dialog sales, FAE and distributor channel in opportunities as directed by AE team leader.

·         Production Test support for APAC customers.

·         Build localised Bluetooth stack knowledge for support of the region.

·         Supporting the online support model (through the Dialog Forums)

·         Some on-site customer travel will be required.

·         Within a team, execute projects for on-time delivery of project goals and objectives.


What We Are Looking For?

·         BS (4+years) or MS (2+ years) in Computer Science, EE, Computer engineering or similar technical field

·         Solid Embedded MCU software knowledge

·         Strong C /C++ programming capability- 100% necessity.

·         Thoroughly experienced with toolchains (e.g. Keil/IAR, Eclipse, GNU tools etc..), debuggers and Lab tools: Logical Analyzer, Oscilloscope, BLE protocol sniffer

·         Experience in MCU Architecture (Cortex –M preferred) as well as various peripherals like SPI/QSPI, I2C, DMA, USB, I2S, UART, PMU, Timers, RTC, SDIO, eMMC, LCD controller, GPU etc.

·         RTOS experience (free RTOS, Threadx …).

·         Good understanding of multi-threaded embedded system concepts

·         Team player.

·         Good interpersonal communication and writing skills in English

·         Hands on experience with Bluetooth Low Energy (BLE) is a strong advantage

 

Dialog in Shanghai

Working in our Shanghai office in Xuhui District, you will become a key part of our multi-cultural and high-performing team, and you will also enjoy the opportunity to work with world-class clients. Shanghai is a very international and popular city where you may enjoy a vibrant living standard with music, art, fine dining and international events.


Why Join Us?

Dialog Semiconductor is a world-leading provider of low-power, advanced mixed-signal ICs creating the next generation of innovative, smart connected devices. In 2019, we generated US $1.4 billion in revenue and we currently have approximately 2,300 employees worldwide.


Working at Dialog we treat each other with respect and fairness, irrespective of gender, race, ethnicity, beliefs, sexual orientation, disability, diversity of thought and experience. We see our differences as strengths and are proud to have an inclusive workforce that values diversity.

We passionately believe that working at Dialog, you will be joining the brightest, most diverse, and ambitious talent in the Semiconductor Industry.


Click below and apply now.

公司介绍

Dialog是为智能手机、可穿戴设备、IoT和汽车应用优化提的高度集成混合信号IC的技术领先供应商。公司采用无晶圆厂制造模式,生产、组装和封装均外包;拥有业界规模***的定制混合信号IC设计团队,并与***OEM厂商建立了牢固的战略合作关系。

Dialog执行稳健,增长快速,并具有强大的现金产生能力;截至2018年12月31日,现金及现金等价物余额为6.78亿美元。全球员工总数达2,100人(工程师约占75%)。

Dialog作为雇主积极承担社会责任,开展各项活动造福员工、社区、其他利益相关方和自然环境。

关键要点
智能手机PMIC市场份额排名***
智能手机RapidCharge?快充电源适配器IC市场份额排名***
可配置混合信号IC(CMIC)市场份额排名***
集成度***,采用可配置电源管理模式的完整系统方法
2017年,我们交付了超过1亿套SmartBond? SoC,创下了里程碑
蓝牙低功耗市场份额排名***,交付了超过1.8亿套具有业内最低功耗的蓝牙芯片。
2018年营收达14.42亿美元

联系方式

  • 公司地址:天津经济技术开发区信环西路19号泰达服务外包产业园