上海招聘

Summary of Role:

GLOBALFOUNDRIES is looking for strong candidates to join our Package design & methodology team. Responsibilities include package laminate and 2.5D Interposer design, SI/PI analysis, electrical modeling of high-speed package structures using Ansys HFSS and related tools; design of high-speed package escape patterns and power delivery structures; development of tools in support of image/package/PCB co-design; and explore advanced package solutions such as 2.5D, 3D package. The ideal candidate is a self-motivated problem solver; is a skilled programmer and software tool developer; and has a proven track record of successful deliveries within a dynamic team environment.

Essential Responsibilities:

• Silicon and Laminate Physical layout

• Develop advanced 2.5D package design solution

• Package and board level SI/PI analysis

• Perform electrical modeling of high-speed structures (BGA/Via, Connector…)

• Use code development expertise to create tools to implement such methodologies

Requirements:

• EE/ME/CS related background in system/chip design, package and board engineer role with industry experience more than 5 years.

• Solid knowledge and extensive industry experience in one or more of the following areas:
  - High speed package/system design experience (High Speed Serdes, HBM, DDR, etc...).
  - Familiar with Industry SI/PI analysis process, system level modeling with analysis tools (Ansys HFSS, Sigrity, SigXp, Hspice, MATLAB, etc...).

- Multiple layers PCB/Laminate (4+) layout experience (Experience with automation, such as cadence APD and
related design tools).

- Familiar with physical design (Floorplan, P&R, DRC, LVS)

• Proven experience with at least one of the following programming languages: tcl, Java, Python, Perl, Skill, C++.

• Good communication skill in both English and Mandarin.

• Strong teamwork sense, good learning competency, self-motivated, and ability to work in diverse areas in a flexible and dynamic environment.

Preferred Qualifications:

• Physical design digital flow experience, e.g. Innovus, ICC2, etc.

• Experience working with laminate suppliers and OSATs

GLOBALFOUNDRIES is the world's only semiconductor foundry with a truly global manufacturing and technology footprint, with 18,000 employees spanning Asia, Europe and the Americas serving over 250 customers including the world’s leading technology companies. We focus on the processes and platforms that will drive markets, so customers with a shared vision of the future can shape their industries.

This is more than just a job, it’s your fingerprint on the future. An opportunity to make semiconductors core to reshaping our lives and providing connectivity to billions, that are helping realize the Internet of Things and redefining transportation.

GLOBALFOUNDRIES China was born with the acquisition of IBM's semiconductor manufacturing business. The IBM Microelectronics acquisition has added additional fabs, a huge portfolio of patents and a large and highly experienced development team. With a heritage of more than two decades in Singapore and an expanding presence in China and India, come join some of the brightest and most innovative people in the industry. Work with industry-leading customers to facilitate innovations you can feel proud of. Work you truly enjoy taking home.

A career where we say: I helped make that possible.