上海招聘

1. 新Package的研发团队成员，配合相关工艺的制定，材料的选用，工程批的制作，相关工艺文件的建立与更新；
2. 新封装工艺的研发与引入和现有封装工艺的优化改进；
涉及的封装工艺主要为: Back Grinding, Wafer Sawing, Soft Solder Die Bond;
3. 新的封装材料的开发和引入;
4. CRP & QCIP项目的实施;
5. 客户项目的应对;

职位要求：

1. 本科以上学历，机械专业毕业；

2. 有良好的沟通能力；

3. 抗压能力强。

GEM Electronics (Shanghai) Co., Ltd is a wholly owned International Enterprise specializing as all-outsourcing manufacturer business of power semiconductors. At present, we have approximately 1200 employees, and our market/business is increasing very rapidly. The career opportunities for this unique and special Company in China that focuses on the power management market. We have several International customers from U.S.A, Japan, Korea and Taiwan. This allows our company a bright future to learn new equipment, new processes, and new management styles that can lead to rewarding financial and technical knowledge returns.
We are now inviting qualified eager, honest, hard-working, high-caliber candidates to fill the following positions.
薪资从优，免费午餐。

工作所在地：上海市嘉定区