Hardware Engineer
德尔福中央电气(上海)有限公司
- 公司规模:1000-5000人
- 公司性质:外资(欧美)
- 公司行业:汽车及零配件
职位信息
- 发布日期:2017-07-14
- 工作地点:上海-嘉定区
- 招聘人数:1人
- 职位月薪:1-1.5万/月
- 职位类别:硬件工程师
职位描述
Responsibilities:
Lead and conduct product mechanical design (BOM, 3D&2D, technical specification, etc.) and technology developing
Ensure execution of common BOD & BOP as defined by BL
Conduct DFMEA, tolerance stack, assembling and interference analysis, be well known on FEA and Moldflow, etc. design analysis works
Conduct DFM review, Engineering gates (RR, PDR, CDR) review;
Follow the ECR/ECN procedure and conduct ECR/ECN process;
Support validation engineering on the validation plan drafting, tests implementation and problem solving
Conduct new developed (molded, stamped, etc.) parts technical status confirmation and support on problem solving
Technical Support for Quotation and new business pursuing
Support application engineering, tooling, manufacturing, quality, etc. functions’ activities
Well known the customer’s application of DDC products (media module and charger, mobile wireless charger, etc.)
Good working cooperation with Electronic Engineer, Software Engineer, System Engineer, etc. Basically knowledge on the TALC (touch, appearance, lighting, color).
Qualifications:
Minimum Bachelor Degree in Mechanical Engineering or Science related
More than 3 years of design work experience in relative area
Deep knowledge of molding and stamping
Good communication skills and proficient in English (oral and written)
Well trained CAD capability or UG/ CATIA/Pro E
Computer, network and MS-office software skills
Basic knowledge in TS16949 and well known automotive product & project developing process
Good learning skills and team work capability
职能类别: 硬件工程师
公司介绍
联系方式
- 公司地址:上班地址:安亭镇园国路200号