上海招聘

职位描述：
注：此职位工作地点在松江

Job Responsibility
? Be part of Process Engineering team, responsible for backend process engineering and manufacturing support of SSD.
? Work closely with CM and corporate internal Design/Hardware/Packaging/Quality teams to develop and verify manufacturing friendly process.
? Mechanical DFM review/Sample buyoff/qualification plan and execution
? Packing material design or DFM review/sample preparation and buyoff/qualification plan and execution
? Label design review/sample preparation and buyoff/implement
? Provide NPI and HVM production support for SSD backend manufacturing, process flow optimization, yield improvement, failure analysis of Qual and production failures.
Qualifications
? Bachelor degree in mechanical engineering or in a comparable field
? Fluent English communication is required
? Experience in the electronics industry.
? Familiar with assembly/labelling/packing process.
? Familiar with Solidworks/Autocad/Codesoft software tools, able to interpret and create 3-D CAD models, create 2-D engineering drawing for mechanical parts, assembly, label and packing material.
? Experience in machined and stamped metal parts, injection molded parts, die-cast parts, labels, packing material.
? A strong knowledge of DFM/A on assembly/labelling/packing
? Excellent teamwork and ability to work well with both internal and external teams from US and China. Strong problem solving skill is required.
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