上海招聘

职位描述：
职位描述：

一、工作职责

Responsibility

- Be responsible for NPI and coordination of new product engineering activities towards the development and release to manufacturing of Discrete products (MOSFET, BJT, SBR, Protection Product, etc).

- Direct communication and collaboration with design, marketing, test development and manufacturing

- The position requires support of product qualification, silicon characterization, product introduction to manufacturing and post introduction support including cost down, yield enhancement and FA

- Work with process, yield and quality group cross functionally to resolve NPD issues associated with fabrication and package.

负责分立器件新产品开发、试生产直至顺利投放量产的项目管理。

需要同设计、市场、测试开发及生产管理等团队进行跨部门沟通和协作。

有能力支持新产品的可靠性、特性测试。同时能够对量产后的产品进行成本递减、良率提升的建议，对失效产品进行有效分析并提出改善建议。

同制造、工程、测试及品质部门协作，针对芯片以及封装测试相关的问题能够提出有效的解决方案。

二、岗位要求

Job Requirements

教育背景Education Background

BSEE and minimum of 5 years experience in Discrete product and test engineering.

大学本科或以上学历，电子/微电子及相关专业, 4年以上分立器件产品测试工程经验

工作经验Working Experience

Proven knowledge of electronic circuits and Discrete product & test engineering.

Working knowledge of Semiconductor Manufacturing processes.

Engineering failure analysis and project management experience are preferred.

拥有丰富的电子电路及集成电路产品工程及测试的相关知识。

熟知集成电路的生产制造流程。

最好有产品失效分析和项目管理经验。

培训经历Training Experience

专业技能

Specialized Skill

This position desires strong Discrete circuits knowledge, good project management and communication skills.

Knowledge of semiconductor manufacturing process and physics are a plus

熟悉分立器件产品、封装测试知识，并能高效的进行项目管理及跨部门沟通。

熟知分立器件芯片制造及半导体物理理论基础良好者优先考虑。

其他要求：

Other Requirements

Good command of English

英文听说读写熟练 举报 分享

本公司是一家日本独资企业，生产加工硬质合金切削工具，位于松江工业区新东部开发区。

本公司提供完善福利：公司缴纳6金、年3次奖金、免费提供工住宿、工作餐、体检、年度旅游、年夜饭等。每年4月份加薪（根据公司销售情况等）。