上海招聘

职位描述：
Responsibilities
? General product industrialization responsibilities in IC manufacturability as well as quality according to automotive standards, in the complete product life cycle from IC development to full production.
? Lead test and product engineers by providing guidance and know-how on testing and characterizing automotive products.
? Define and review Design-for-Test and Design-for-Excellent strategy and plan during the IC development phase.
? Define and review test and product characterization strategy, plan and flow with test and product engineers.
? Interacting with project management office on TPE project schedule regarding to IC qualification and release in IC development phase.
? Responsible for product safe launch and pilot production, ensure high product yield, low costs and automotive product quality in full production;
? Interfacing to frontend and backend manufacturing fabs regarding engineering issues
? Hiring and training Test and Product engineers as needed

Education Requirements/Preference

? This position requires a Masters or PhD Degree (in EE or related field) with a minimum 10+ years of related experience, preferably in automotive applications.
? Proven track records in bringing ICs from design phase into production.
? Extensive experience in managing test and product engineering teams.
? Extensive knowledge in design of experiments, statistical methods, and data analysis is a must.
? Affinity with semiconductor product testing and characterization equipment.
? Proven ability to achieve results in a fast moving, dynamic environment. Strong quality mindset in automotive “Zero Defects”.
? Self-motivated, self-directed, ability to work well with people.
? The candidate must have a proven desire to work as a team member, both on the same team and outside of the team, and within cross-functional environment.
? Should be able to troubleshoot, multi-task and meet deadlines.
? The candidate should possess excellent communication (written and verbal) and interpersonal skills. 举报 分享

关于大唐恩智浦半导体有限公司
大唐恩智浦半导体有限公司，成立于2014年3月，是中国首家汽车半导体公司。公司由大唐电信科技股份有限公司与全球领先的半导体安全连接解决方案供应商荷兰恩智浦半导体有限公司共同出资成立。公司业务定位于新能源汽车，混合动力汽车电源管理和驱动，以及新能源相关的集成电路设计领域，专注于研发和销售采用高性能混合信号技术的高级专用汽车电子IC，致力于成为全球领先的汽车半导体公司。更多信息请访问公司官网：www.datangnxp.com