顺德招聘

Responsibilities

· Sustain current package designs for improvements in quality, cost, transport and handling efficiency.

· Direct 3rd party & Logitech internal quality resources in receipt/approval of new package parts.

· Process engineering, DFMA skill sets, communicating with vendors, help identify and improve their processes.

· Lead package engineering vendors and be responsible for effectively managing the end to end development process to meet or exceed packaging targets - including design innovation, cost, quality and schedule,

· Perform necessary tests on new package designs to ensure compliance with Logitech qualification criteria. Provide required written test results.

· Improve packaging design to support producibility and/or cost savings.

· Contribute to the evolution of Logitech packaging design and qualification procedures to suit retail supply chain environment.

· B kind of packaging materials and their usages as corrugated paper, art paper, plastic, wooden etc;

· Lead and develop packaging engineering testing coordinators.

Requirements

· Thorough knowledge of manufacturing processes and the ability to design within reasonable limits of these processes.

· ISTA/ASTM knowledge a must.

· Knowledge and usage of Artios CAD

· Thorough knowledge of a variety of packaging materials including paper boards, corrugate, plastics

· Thorough knowledge of packaging assembly process include manual assembly, blister pack heat, RF and other methods of sealing/tamper proofing retail packages.

· Ability to develop and document qualification and inspection protocol for packaging materials and systems.

· Knowledge of costs associated with different materials used in package design

· Be knowledgeable of all types of packaging materials and their usages such as corrugated paper, art paper, plastics, acrylic, etc.

· Knowledge of freight methods used for distribution of retail products

· General knowledge of graphic printing , associated equipment and materials (inks, coatings, etc)

· General knowledge of environmental regulations/initiatives related use of packaging materials

· Ability to analyze, debug and suggest solution for package design issues/challenges

· Superior communication skills required.

· Strong Leadership ability in order to work with vendors/suppliers to get our packages manufactured to the highest levels of quality and appearance.

· Excellent English language skills

· Education: BS in Packaging Engineering or equivalent

· 5-7 years of experience in packaging design and engineering

瑞士罗技电子是世界知名的电脑周边设备供应商，其业务范围涵盖市场拓展、产品规划、设计研发、生产制造与物流服务。罗技在美国加州的Fremont、瑞士洛桑的Romanel，以及中国台湾的新竹科学园区等地设有营运总部。此外，在世界各主要国家，如德国、法国、荷兰、爱尔兰、新加坡与日本，均设有分公司或营销中心。

    罗技的产品主要包括鼠标、键盘、音箱、网络摄像头、游戏周边设备，游戏控制装置等。其优异的品质和完善的服务得到IBM、HP、DELL、Sony、Toshiba等在内的全球20多家知名厂商的高度认可。

    满足客户需求、注重科技发展、稳定的结构与积极的环境、创新、扩充、迅速响应的态度——正是这些最为简单却又至关重要的元素，推动着我们不断向前，促成了“罗技”这一个家喻户晓的品牌。

    位于苏州新区的罗技科技（苏州）有限公司（原“苏州罗技电子有限公司”）为罗技全球***的产品制造基地之一。成立于1994年2月并经过十余年不断的发展，现已成为年销售额达4亿美元，苏州地区出口额***的企业之一。2005年7月，罗技位于新区嵩山路占地面积达13万平方米的全新标准化厂房已正式投产，崭新的环境和产能的扩大，必将使我们更为自信地迎接来自全球资讯电子业的挑战。

    成立于2001年的罗技科技苏州研发中心是罗技公司位于中国最核心的研发部门，主要从事罗技产品的设计、开发、验证等相关工作。经过多年历练与成长，我们现今已发展成为一支技术力量雄厚、经验丰富的专业研发团队，团队成员拥有多年产品研发经验，也是罗技全球战略的重点之一。我们坚信能为员工提供舒适人性化的工作环境、极具竞争力的薪酬/福利和系统的培训机会,以及广阔的职业发展前景。在中国成为全球最重要的经济体的同时，我们真诚邀请您加入我们，一起携手共创罗技新的辉煌。

    在罗技，优秀的人才始终是推动公司不断发展的原动力。我们尊重知识、尊重人才，强调专业技能和素质的持续学习与进步，提升员工自身价值，并为表现优秀的员工提供职业发展规划与海外培训机会。

    我们期待您的加入，携手共进，共享机遇与挑战！

公司地址：苏州高新区嵩山路3号
公司招聘官网： https://jobs.jobvite.com/logitech