长春招聘

？ Product yield analysis and improvement
？ Image sensor packing solution development and communication (ceramic, COB..)
？ Chip assembly process management and quality control
？ Incoming inspection: wafer / ceramic package / glass lid / assembled device
？ Supply chain management with subcontractors
？ Image sensor product quality & reliability control

Minimum requirements
? Min. 2 years’ working experience in the field of IC manufacture industry
? Master in engineer: Electronic, Physics, Optics or Mechanics are preferable
? Basic knowledge of C / C++/ Java
? Fluent written and verbal skills in English
? Team player and open to technical challenge with diversities.
? Strong communication skill

Additional qualifications
? Experience with IC assembly flow is a plus

公司主要从事光电芯片、仪器设备等平台及应用软件的研发、销售及相关光电子、微电子领域的技术开发、转让、咨询和服务。产品应用领域广泛，各种工业、医疗、科学研究行业均有涉及，并具有很强的市场竞争力。
如您对本公司职位感兴趣，请发送简历到hr@gpixelinc.com