Design Implementation Engineer / Sr
芯原微电子(上海)有限公司
- 公司规模:500-1000人
- 公司性质:外资(欧美)
- 公司行业:电子技术/半导体/集成电路
职位信息
- 发布日期:2012-07-31
- 工作地点:上海-浦东新区
- 招聘人数:若干
- 工作经验:二年以上
- 学历要求:本科
- 语言要求:英语良好
- 职位类别:集成电路IC设计/应用工程师
职位描述
Job Responsibility:
1.Responsible for SDC and UPF/CPF development and debug
2.Focus on design floor planning, power planning, IO planning, placement & CTS and routing, handling timing and congestion issue during project implementation
3.IP level and chip level physical verification and DFM rule checking
4.Power analysis and IR drop/EM analysis for both static and dynamic
5.Strong capability in timing analysis, and independently handle all timing issues from netlist/RTL to GDS process
6.Responsible for timing signoff for all functional modes and concerns, and work closely with DFT engineer for scan modes timing closure
7.Work closely with package team and IO team regarding IO placement to address IO ESD, SSO and chip power supplement concerns
8.Communicate with customer as well as AE or sales
Requirement :
1.Bachelor’s degree or above in EE
2.Skill in csh/perl/tcl
3.For Senior Engineer position, 2+ years work experience in relevant areas is required
4.Good knowledge in at least one of the following disciplines: high speed chip P&R skills, 90nm/65nm chip P&R, hierarchical flow or low power P&R implementation, physical layout & verification
5.Rich experience on timing/noise violation fixing and CTS tree synthesis
6.Good understanding about entire development flow of IC design
7.Good understanding about FE design, process, package, testing, etc.
8.Fluent in both English and Chinese
9.Self motivated, good communication skill and team work spirit
公司介绍
芯原的SiPaaS解决方案可缩短设计周期、提高产品质量和降低风险。宽泛和灵活的SiPaaS解决方案为包含新兴和成熟半导体厂商、原始设备制造商(OEMs)、原始设计制造商(ODMs),以及大型互联网平台提供商在内的各种客户类型提供极具吸引力的半导体产品替代解决方案。
芯原的芯片平台包括可授权的Vivante GPU核和视觉图像处理器,基于ZSP®(数字信号处理器核)的高清音频、高清语音平台和多频多模无线平台, Hantro高清视频平台,可穿戴设备平台,物联网(IoT)平台,面向语音、手势和触摸界面的混合信号自然用户界面(NUI)平台。芯原的一站式芯片定制服务所涵盖的内容包括:面向一系列宽泛的工艺制程节点(含28nm和22nm FD-SOI、FinFET等先进工艺节点),结合自身技术解决方案和增值的混合信号IP组合所提供的设计服务,以及为系统级芯片(SoC)和系统级封装(SiP)所提供的产品设计及工程服务。
芯原成立于2001年,总部位于中国上海。
联系方式
- 公司地址:地址:span松涛路560号张江大厦