北京招聘

Job Description:

- Develops regional business plan and sales strategy that ensures attainment of company sales goals and profitability.

- Works with regional FAE team to close deals and accomplish regional revenue quota.

- Identifies potential new opportunities with assigned accounts or develop new accounts for further business growth.

- Maintains regular contact with the assigned accounts to build a good and reliable business relationship.

- Provides sales support to the assigned accounts.

- Provides forecast for regional revenue based on information from customers.

- Credit collection from the assigned accounts.

- Adheres to all company policies, procedures and business ethics codes and ensures that they are communicated and implemented within the team.

Requirements/Qualifications (Education):

- at least 7 years of sales experiences managing/coordinating simultaneous complex selling situations, sound track record of growing territory revenue.

- Excellent execution skills, be able to generate sales leads, negotiate business and contract terms, and identify/track and close action items. Good at closing complicated deals.

- Excellent project management skills, able to deal multiple, time critical projects while maintaining a high attention to detail, proactively seek for solutions.

- Excellent and effective oral and written communications skills in both Chinese and English, including the ability to express ideas clearly and concisely, and the ability to present effectively in front of customers and colleagues.

- Excellent interpersonal skills, and work effectively as part of China sales team.

- Sound knowledge in ASIC design service and in-depth understanding of customer and market dynamics and requirements.

- Good connection with IP/EDA vendors and/or foundry/assembly/testing houses will be a plus

- Good understanding of wireless, multimedia and telecom/datacom will also be a plus.

芯原股份有限公司（芯原）是一家芯片设计平台即服务（Silicon Platform as a Service，SiPaaS™）提供商，为包含移动互联设备、数据中心、物联网（IoT）、可穿戴设备、智能家居和汽车电子等多种终端市场在内的各种广泛应用提供以IP为中心的、基于平台的芯片定制服务和一站式端到端的半导体设计服务。

芯原的SiPaaS解决方案可缩短设计周期、提高产品质量和降低风险。宽泛和灵活的SiPaaS解决方案为包含新兴和成熟半导体厂商、原始设备制造商（OEMs）、原始设计制造商（ODMs），以及大型互联网平台提供商在内的各种客户类型提供极具吸引力的半导体产品替代解决方案。

芯原的芯片平台包括可授权的Vivante GPU核和视觉图像处理器，基于ZSP®（数字信号处理器核）的高清音频、高清语音平台和多频多模无线平台， Hantro高清视频平台，可穿戴设备平台，物联网（IoT）平台，面向语音、手势和触摸界面的混合信号自然用户界面（NUI）平台。芯原的一站式芯片定制服务所涵盖的内容包括：面向一系列宽泛的工艺制程节点（含28nm和22nm FD-SOI、FinFET等先进工艺节点），结合自身技术解决方案和增值的混合信号IP组合所提供的设计服务，以及为系统级芯片（SoC）和系统级封装（SiP）所提供的产品设计及工程服务。

芯原成立于2001年，总部位于中国上海。