北京 [切换城市] 北京招聘

Product Manager - Packaged Components

芬普信息科技(上海)有限公司

  • 公司规模:150-500人
  • 公司性质:外资(欧美)
  • 公司行业:电子技术/半导体/集成电路

职位信息

  • 发布日期:2017-07-01
  • 工作地点:上海-浦东新区
  • 招聘人数:1人
  • 工作经验:5-7年经验
  • 学历要求:本科
  • 语言要求:英语 精通
  • 职位月薪:1.5-3万/月
  • 职位类别:配置管理工程师  

职位描述

职位描述:
Job purpose:
The Product Manager – Packaged Components is responsible for the lifecycle management of all FPC packaged component deliverable in existing and future product offerings. In this position, you are working closely with the Product Owners (total product offering responsible), R&D packaged component engineering team, sales and customer support to secure the right mix of packaged component variants and availability towards our customers.

Key responsibilities and accountability - includes but is not limited to:
? Responsibility for FPC packaged components deliverable of existing and future FPC product offerings, life cycle management, from defining requirements through development, drive optimization of COGS, launch and follow up until the package component is obsolete.
? Main interface towards Product Owners for the package component dimension & deliverable
? Main interface from Product Management towards R&D packaged component organization with mandate to prioritize and drive market and customer requirements relative to internal capabilities.
? Main interface towards Sales and Customer Project managers in translating customer requirements into requirements on the packaged component product and drive and communicate product capabilities and readiness.
? Responsible for driving the packaged component roadmap for future Product Offerings within Product Management including Collecting requirements from customers, competitors, module houses, OSAT:s or other relevant stakeholders.

Requirements (work experience and education)
? Master of Science degree, more than 5 years of experience
? Fluent in English
? 5 year experience in product management, project management in an international environment related to semiconductor products, preferably for the mobile devices industry
? Great interest and good understanding of embedded hardware, production and quality

Expected behaviours (e.g. structured, analytical, communicative, drive, efficient, flexibility, creativity)
? Well organized with a strategic mind
? Good sense for prioritizing
? Analytical and structured being able to handle a lot of information
? Strong sense of responsibility for making sure the packaged products become commercial successes
? Be able to respond well to pressure
? Think creatively and have an positive approach to new ideas
? Excellent verbal and written communication
? Extrovert personality with experience in interacting with customers

Misc.
? This position will require business travelling

职能类别: 配置管理工程师

关键字: Product Manager Packaged Components

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公司介绍

Fingerprints develops biometric systems comprising sensors, algorithms, software and packaging technoligies. The success is based on product development at the cutting edge of technology, which results in world-leading products in terms of security, convenience and performance. The current product range consists largely of fingerprint sensors and customers are primarily manufacturers of smartphones and tablets, where the company is market leading. As the use of biometric solutions increases, Fingerprints is working to broaden their offer by using different biometric techniques, or modalities, and to identify other market segments where the solutions can be used, such as smart cards, PCs, automotive and online devices (IoT).

The Fingerprints share is listed on Nasdaq Stockholm (FING B). The company has shown a strong growth and sales totaled of 6,638 MSEK in 2016, with an operating margin of 39 percent. Most of the more than 400 employees work in Sweden, but the company has offices worldwide, from Shanghai to Silicon Valley.

联系方式

  • 公司地址:广顺南大街16号院2号楼15层